Certified Global Research Member
Key Questions Answered
- Global Market Outlook
- In-depth analysis of global and regional trends
- Analyze and identify the major players in the market, their market share, key developments, etc.
- To understand the capability of the major players based on products offered, financials, and strategies.
- Identify disrupting products, companies, and trends.
- To identify opportunities in the market.
- Analyze the key challenges in the market.
- Analyze the regional penetration of players, products, and services in the market.
- Comparison of major players’ financial performance.
- Evaluate strategies adopted by major players.
- Recommendations
Why Choose Market Research Future?
- Vigorous research methodologies for specific market.
- Knowledge partners across the globe
- Large network of partner consultants.
- Ever-increasing/ Escalating data base with quarterly monitoring of various markets
- Trusted by fortune 500 companies/startups/ universities/organizations
- Large database of 5000+ markets reports.
- Effective and prompt pre- and post-sales support.
The demand for 3D packaging using Through-Silicon Vias (TSVs) is on the rise, driving the development of 3D Integrated Circuits (ICs). IC design and packaging teams are closely examining the vertical stacking of multiple chips and chipsets as the need for higher density, increased bandwidth, and lower power becomes more pressing. This technology, known as 3D-IC, offers various advantages over traditional single-die planar designs.
In simple terms, 3D-IC technology allows designers to stack multiple homogenous and heterogeneous die/chipsets, such as those for logic, memory, analog, and RF, into a single design. By doing so, they can pack more functionality into smaller form factors, improve performance, and reduce costs by integrating advanced packaging technologies. This approach serves as an alternative to monolithic System-on-Chip (SoC) integration, potentially avoiding the expensive transition to a new process node for all the features designers want in a single design.
The significance of 3D-IC architectures lies in their impact on various industries, including mobile communications, networking, graphics, and computing. This is particularly true in fields where there is a demand for ultra-lightweight, compact, and low-power devices. Examples of specific applications include multi-core CPUs, packet buffers/routers, GPUs, smartphones, tablets, netbooks, cameras, DVD players, and set-top boxes.
Despite the growing interest in 3D-IC technology, it is still in its early stages. The production and design of semiconductors must now include 3D IC packaging. This technology has both macro and micro-level impacts. On a macro level, it directly affects cost, power consumption, and performance. On a micro level, it influences the fundamental operation of every chip.
One of the driving factors behind the increasing demand for 3D IC packaging is the development potential for vendors, especially in the context of growing data centers. The amount of big data stored in data centers globally is projected to reach 403 exabytes in 2021, with a significant portion of this total attributed to the United States. In 2021, there were 700 hyperscale data centers, a substantial increase from 259 in 2015. These factors collectively contribute to the acceleration of market growth.
Covered Aspects:
| Report Attribute/Metric | Details |
|---|---|
| Segment Outlook | Components, Applications, Technology, Products, and Region |
3D IC Market Highlights:
Global 3D IC Market Overview:
3D IC Market Size was valued at USD 9.6 Billion in 2023. The 3D IC market industry is projected to grow from USD 11.52 Billion in 2024 to USD 41.5 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 17.36% during the forecast period (2024 - 2032). Increased demand for advanced electronic products and high demand for 3D packaging using TSVs are the key market drivers enhancing the market growth.
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
3D IC Market Trends
-
Growing demand for advanced electronic products is driving the market growth.
Market CAGR for 3D IC is driven by the rising demand for advanced electronic products. Developing smart cars, industrial gear, and infrastructure brings the significant potential to the 3D IC market. The widespread use of smartphones and other wearable technology worldwide is another feature defining the dynamic integrated circuit market environment. The market value for 3D integrated circuits will also increase due to the increasing demand from the ICT sector.
In addition, the market is developing due to the rising demand for integrated circuits and improved electronics architecture with low power consumption characteristics. This is further helped by the new trend of IC integration and wafer-level packaging in sensors and other miniaturized electronic devices. Further aiding market expansion is the widespread use of 3D IC smart home appliances such as security locks, thermostats, fan controls, smart smoke alarms, window sensors, and energy monitors. They are also included in many medical devices, including tiny heart monitors, sight and hearing aids, and other medical equipment. Consumer knowledge of the many benefits of the products-better speed, memory, durability, efficiency, performance, and fewer timing delays- is growing, boosting the market growth.
As countless of new devices are connected to the internet, IoT technology is expanding at a rate that fuels expansion. In addition, new units, such as computers, sensors, data storage devices, and associated infrastructure, explain the increased demand that these electronic components experience due to their capacity to communicate with one another and integrate into networks and software systems. Thus, driving the 3D IC market revenue.
3D IC Market Segment Insights:
3D IC Components Insights
The 3D IC Market segmentation, based on components, includes Through Glass Vias (TGVs), Through Silicon Vias (SGVs), and others. The through silicon vias (TGVs) segment dominated the market, accounting for maximum market revenue. TGVs are expanding exponentially due to smart electronics such as smartphones, tablets, laptops, and other devices becoming more widely used. Since these TSVs are mostly employed in constructing 3D integrated circuits (ICs) and IC packaging, which is among the essential elements in producing smart electronics. In addition, the TSVs offer the best connectivity compared to traditional flip-chips and wire bonds.
Figure 1: 3D IC Market, by Components, 2022 & 2032 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
3D IC Application Insights
The 3D IC Market segmentation, based on application, includes aerospace & industrial, telecommunication & IT, automotive, consumer electronics, medical, industrial, and others. The consumer electronics segment generated the most income. As a result of the rising demand for various innovative and small consumer electronics goods with improved functionality, such as laptops, smartphones, and tablets, the consumer electronics industry has experienced significant growth.
3D IC Technology Insights
The 3D IC Market segmentation, based on technology, includes technology type, 3D stacked ICs, Monolithic 3D ICs, and integration and packaging type. The 3D stacked ICs segmentation has dominated the market due to its functionality, performance, power consumption, and combination of costs. Additionally, 3D stacked ICs are growing due to increased application across industries.
3D IC Products Insights
The 3D IC Market segmentation, based on products, includes 3D memory, light-emitting diodes (LEDs), CMOS image sensors, and sensors and MEMs. The sensors and MEMs category generated the most income due to the functional components of MEMs microactuators, microsensors, and microelectronics. The advanced elements of MEMs are gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors, among others. The main need in all these elements and sensors is a miniature structure. Therefore, many sensors have started using 3D IC.
3D IC Regional Insights
By region, the study provides market insights into North America, Europe, Asia-Pacific and Rest of the World. The North American 3D IC market will dominate this market due to the massive demand for security systems and business intelligence. Additionally, the easy availability of raw materials and increasing demand for 3D integrated circuits will boost the market growth in this region.
Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.
Figure 2: 3D IC Market SHARE BY REGION 2022 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Europe 3D IC market accounts for the second-largest market share due to rising demand for IoT-based electronics. Further, the German 3D IC market held the largest market share, and the UK 3D IC market was the fastest-growing market in the European region.
The Asia-Pacific 3D IC Market is expected to grow at the fastest CAGR from 2023 to 2032 due to rising demand for consumer electronics and the use of smart devices. Moreover, China’s 3D IC market held the largest market share, and the Indian 3D IC market was the fastest-growing market in the Asia-Pacific region.
3D IC Key Market Players & Competitive Insights
Leading market players are investing heavily in research and development to expand their product lines, which will help the 3D IC market, grow even more. Market participants are also undertaking various strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the 3D IC industry must offer cost-effective items.
Manufacturing locally to minimize operational costs is one of the key business tactics manufacturer’s use in the global 3D IC industry to benefit clients and increase the market sector. In recent years, the 3D IC industry has offered some of the most significant advantages to 3D ICs. Major players in the 3D IC market, including United Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang Inc., IBM Corporation, Xilinx Inc., Monolithic 3D Inc., Intel Corporation, Toshiba Corp. Amkor Technology, Samsung Electronics Co. Ltd., and others, are attempting to increase market demand by investing in research and development operations.
Siemens Digital Industries Software is an American computer software organization specializing in 3D & 2D Product Lifecycle Management tools. The corporation, which has its corporate headquarters in Plano, Texas, goes by the legal name Siemens Industry Software Inc. For Instance: September 2022, Siemens Digital Industries Software and United Microelectronics (UMC), a top semiconductor foundry, announced the creation of a workflow for 3D integrated circuits (ICs) hybrid bonding. For UMC’s wafer-on-wafer and chip-on-wafer technologies, businesses have created a new multi-chip 3D IC planning, assembly validation, and parasitic extraction (PEX) workflow.
STMicroelectronics N.V., sometimes known as ST or STMicro, is a Dutch global firm specializing in technology with French and Italian roots. Its headquarters are Plan-les-Ouates, which is close to Geneva, Switzerland and listed on the French stock exchange. The largest semiconductor, contract manufacturing and design business in Europe is ST. In 1987, Thomson Semiconductors of France and SGS Microeletronica of Italy, two government-owned semiconductor businesses, merged to form the corporation. For instance: in September 2022, a sophisticated VDA-complaint LIN alternator regulator was revealed by STMicroelectronics, a British company, to improve the performance and adaptability of 12V automotive systems. With the help of a 3D IC and improved functionality, STMicroelectronics unveiled the L9918 automotive alternator regulator to guarantee the reliability of 12V automotive systems. L9918 allows users to specify settings such as alternator characteristics and voltage set points.
Key Companies in the 3D IC market include
-
United Microelectronics Corporation
-
Tezzaron Semiconductor Conductor Corporation
-
3M Company Besang Inc.
-
IBM Corporation
-
Xilinx Inc.
-
Monolithic 3D Inc.
-
Intel Corporation
-
Toshiba Corp. Amkor Technology
-
Samsung Electronics Co. Ltd.
3D IC Industry Developments
March 2022: Amkor Technology, a trade with South Korea headquarters, joins hands with the TSMC OIP 3D Fabric. With initial access to TSMC’s 3D Fabric technology, the new 3D Fabric Alliance’s partners can advance their products parallel with TSMC. They can also propose a steady supply of 2.5 ICs and 3D ICs of premium quality.
October 2021: Cadence Design Systems, Inc announced the delivery of the Integrity 3D-IC platform. It is the first 3D IC platform on the market to combine system analysis, design planning, and high capacity 3D implementation into a unified cockpit.
May 2021: Intel expects to spend USD 3.5 billion upgrading its Rio Rancho facility, one of its three main US manufacturing hubs, and aiding more than 35% of its workforce there. It is enlarging its facilities in New Mexico to produce new generations of chips based on its Foveros 3D packaging technology, which might support the business’s efforts to restore its position as the market leader in the semiconductor sector.
3D IC Market Segmentation:
3D IC Components Outlook
-
Through Glass Vias (TGVs)
-
Through Silicon Vias (TSVs)
-
Others
3D IC Application Outlook
-
Aerospace & Industrial
-
Telecommunication & IT
-
Automotive
-
Consumer Electronics
-
Medical
-
Industrial
-
Others
3D IC Technology Outlook
-
Technology Type
-
3D Stacked ICs
-
Monolithic 3D ICs
-
Integration and Packaging Type
3D IC Products Outlook
-
3D memory
-
Light Emitting Diodes (LEDs)
-
CMOS Image Sensors
-
Sensors and MEMs
3D IC Regional Outlook
-
North America
-
US
-
Canada
-
-
Europe
-
Germany
-
France
-
UK
-
Italy
-
Spain
-
Rest of Europe
-
-
Asia-Pacific
-
China
-
Japan
-
India
-
Australia
-
South Korea
-
Australia
-
Rest of Asia-Pacific
-
-
Rest of the World
-
Middle East
-
Africa
-
Latin America
-
Leading companies partner with us for data-driven Insights
Kindly complete the form below to receive a free sample of this Report
Tailored for You
- Dedicated Research on any specifics segment or region.
- Focused Research on specific players in the market.
- Custom Report based only on your requirements.
- Flexibility to add or subtract any chapter in the study.
- Historic data from 2014 and forecasts outlook till 2040.
- Flexibility of providing data/insights in formats (PDF, PPT, Excel).
- Provide cross segmentation in applicable scenario/markets.
