In order to gather both qualitative and quantitative insights, supply-side and demand-side stakeholders were interviewed during the primary research phase. CEOs, VPs of Manufacturing, heads of wafer fabrication, and business development directors from silicon carbide substrate producers, epitaxy service providers, and power semiconductor OEMs were examples of supply-side sources. Demand-side sources comprised chief engineers from automobile OEMs, renewable energy system integrators, defense procurement officers, and sourcing managers from EV charging infrastructure developers, solar inverter makers, and industrial power electronics firms. Market segmentation, capacity expansion schedules, and information on technology adoption curves, pricing volatility, and supply chain localization tactics were all corroborated by primary research.
Primary Respondent Breakdown:
By Company Tier: Tier 1 (38%), Tier 2 (40%), Tier 3 (22%)
By Designation: C-level Primaries (28%), Director Level (32%), Others (40%)
By Region: North America (32%), Europe (30%), Asia-Pacific (33%), Rest of World (5%)
[Note: Tier 1 = >USD 10B revenue; Tier 2 = USD 1B-10B; Tier 3 =
Global market valuation was established using production capacity mapping and wafer shipment research. The methods included:
Identification of 50+ significant manufacturers in North America, Europe, Asia-Pacific, and emerging markets
Product mapping for epitaxial wafers, discrete devices/modules, green and black silicon carbide, and SiC substrates Analysis of reported and modeled yearly sales specific to silicon carbide product lineups
Coverage of manufacturers with 75-80% global market share in 2024
Extrapolation employing bottom-up (wafer volume × ASP by diameter and application) and top-down (manufacturer revenue validation) methodologies to create segment-specific valuations