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Chip On Flex Market

ID: MRFR/SEM/1483-CR
100 Pages
Ankit Gupta
January 2017

Chip on Flex Market Research Repor By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Industry Size, Share and Trends 2030

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Summary Table of Contents Segmentation Download PDF

Chip On Flex Market Summary

As per Market Research Future Analysis, the Global Chip-on-Flex (COF) Market is a semiconductor assembly technology that directly mounts microchips on flexible circuits, enhancing design efficiency and product performance. The market is driven by the rising demand for compact and flexible electronics across various sectors, including displays, sensors, and biomedical implants. The market is projected to grow from approximately USD 1,437 Million in 2016 to USD 1,868.63 Million by 2030, with a CAGR of 3.7%. However, growth may be hindered by rising raw material costs and evolving consumer demands for more efficient electronics. The market is segmented by type, application, and verticals, with single-sided COF holding a significant market share of 94.43%.

Key Market Trends & Highlights

Key trends influencing the Chip-on-Flex market include technological advancements and regional growth dynamics.

  • Market Size in 2016: USD 1,437 Million; Expected Market Size by 2030: USD 1,868.63 Million.
  • Single-sided COF captures 94.43% of the market share.
  • Europe holds the largest market share, projected to grow significantly during the forecast period.
  • Asia Pacific is expected to record the highest growth rate due to numerous manufacturers in China.

Market Size & Forecast

2016 Market Size USD 1,437 Million
2030 Market Size USD 1,868.63 Million
CAGR 3.7%

Major Players

Key players in the Chip-on-Flex market include LGIT Corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond Technology Corporation (Taiwan), and Danbond Technology Co. Ltd. (China).

Market Segment Insights

Key Players and Market Share Insights

The prominent players in the market of chip on flex (COF) market are – LGIT corporation (U.S.), Stemko group (Korea), Flexceed(Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan),

Danbond technology

co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Market Segmentation:

The Global chip on flex Market has been segmented on the basis of types, applications and verticals. 

The types of chip on flex are one sided chip on flex and others. 

The COF applications comprises of static and dynamic flexing. 

The various verticals of chip on flex market are military, medical, aerospace, electronics and others.

Market Regional Analysis

The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world.

Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others.  Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector.  American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market.  Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.

Intended Audience

    • COF manufactures
    • Industries such as aerospace, automotive, IT, industrial, and medical, among others
    • Government institutions
    • Research institutions
    • Adhesive manufacturers
    • Conductor and insulator manufacturers like silver, copper and others

Market Segmentation

Intended Audience

  • COF manufactures
  • Industries such as aerospace, automotive, IT, industrial, and medical, among others
  • Government institutions
  • Research institutions
  • Adhesive manufacturers
  • Conductor and insulator manufacturers like silver, copper and others

Report Scope

Attribute/Metric Details
Market Size in 2030 USD 1,868.63 Million
Compound Annual Growth Rate (CAGR) 3.7% (2022-2030)
Base Year 2021
Forecast Period 2022-2030
Historical Data 2020
Forecast Units Value (USD Million)
Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
Segments Covered Type, Application, Verticals
Geographies Covered North America, Europe, Asia-Pacific, and Rest of the World (RoW)
Countries Covered The U.S, Canada, Mexico, Germany, France, UK, China, Japan, India, Australia, South Korea, UAE, and Brazil
Key Companies Profiled LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand)
Key Market Opportunities The rapid adoption of modern technologies in automobile sector.
Key Market Dynamics Increasing need for small and flexible electronics in various applications.

Market Highlights

Author
Ankit Gupta
Senior Research Analyst

Ankit Gupta is an analyst in market research industry in ICT and SEMI industry. With post-graduation in "Telecom and Marketing Management" and graduation in "Electronics and Telecommunication" vertical he is well versed with recent development in ICT industry as a whole. Having worked on more than 150+ reports including consultation for fortune 500 companies such as Microsoft and Rio Tinto in identifying solutions with respect to business problems his opinions are inclined towards mixture of technical and managerial aspects.

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FAQs

At what CAGR the global market for Global Chip on flex is expected to rise in the future?

A CAGR of 3.7% has been calculated for the Global Chip on flex’s growth in the future.

Which region has been regarded as the most significant recording highest Global Chip on flex market share?

Europe has been regarded as the most significant region for market share and is growing with a market share of USD 1,868.63 Million by 2030.

How has the global Chip on flex market maintained its growth graph currently?

The activities such as joint ventures, mergers and acquisitions, new product developments, and research and developments has helped global Chip on flex market maintained its growth graph.

Which top names of key players have been included in the analysis of Global Chip on flex market?

Stemko group(Korea), Flexceed(Japan), LGIT corporation (U.S.), Chipbond technology corporation(Taiwan), CWE(Taiwan) are the top names of key players.

What are the segments mentioned in the market for Global Chip on flex market?

The segments such as types, applications and verticals are mentioned in the market study for Global Chip on flex.

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