×
Request Free Sample ×

Kindly complete the form below to receive a free sample of this Report

* Please use a valid business email

Leading companies partner with us for data-driven Insights

clients tt-cursor
Hero Background

New Packages Materials Power Devices Market

ID: MRFR/EnP/6025-CR
175 Pages
Aarti Dhapte
July 2025

New Packages And Materials For Power Devices Market Research Report Information By Product Type (Chip-On-Board (COB), Wire Bonding Packaging, Gallium Arsenide (GaAs), Gallium Nitride (GAN), Silicon Carbide (SIC), Other Packages/Material), By application (Automotive, Consumer Electronics, Industrial, IT & Telecommunications, Military & Aerospace, Others) and By Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) – Market Forecast Till 2035

Share:
Download PDF ×

We do not share your information with anyone. However, we may send you emails based on your report interest from time to time. You may contact us at any time to opt-out.

New Packages Materials Power Devices Market Infographic
Purchase Options

New Packages Materials Power Devices Market Summary

As per MRFR analysis, the New Packages Materials Power Devices Market was estimated at 2.88 USD Million in 2024. The New Packages Materials Power Devices industry is projected to grow from 3.15 USD Million in 2025 to 7.74 USD Million by 2035, exhibiting a compound annual growth rate (CAGR) of 9.4 during the forecast period 2025 - 2035.

Key Market Trends & Highlights

The New Packages Materials Power Devices Market is poised for substantial growth. This growth is driven by technological advancements and sustainability initiatives.

  • North America remains the largest market for new packaging materials in power devices. This reflects robust demand across various sectors.
  • The Asia-Pacific region is emerging as the fastest-growing market, propelled by increasing investments in renewable energy and consumer electronics.
  • Consumer electronics dominate the market, while the renewable energy segment is experiencing rapid growth due to heightened environmental awareness.
  • Key market drivers include the rising demand for electric vehicles and advancements in packaging materials that support miniaturization and sustainability.

Market Size & Forecast

2024 Market Size 2.88 (USD Million)
2035 Market Size 7.74 (USD Million)
CAGR (2025 - 2035) 9.4%

Major Players

Infineon Technologies (DE), Texas Instruments (US), STMicroelectronics (FR), ON Semiconductor (US), NXP Semiconductors (NL), Mitsubishi Electric (JP), Renesas Electronics (JP), Broadcom Inc. (US)

New Packages Materials Power Devices Market Trends

The New Packages Materials Power Devices Market is currently experiencing a transformative phase. This phase is driven by advancements in technology and increasing demand for efficient energy solutions. The integration of innovative materials is reshaping the landscape, enabling devices to operate at higher efficiencies while minimizing thermal management challenges. This evolution is not merely a response to market needs but also reflects a broader trend towards sustainability and environmental responsibility. As industries seek to reduce their carbon footprints, the adoption of new packaging materials that enhance performance and reliability becomes paramount. Moreover, the market appears to be influenced by the growing emphasis on electric vehicles and renewable energy systems. These sectors require power devices that can withstand rigorous operational conditions while maintaining optimal performance. Consequently, manufacturers are investing in research and development to create materials that not only meet these demands but also offer enhanced durability and longevity. The future of the New Packages Materials Power Devices Market seems promising, with potential for further innovations that could redefine industry standards and practices.

Sustainability in Material Selection

There is a noticeable shift towards sustainable materials in the New Packages Materials Power Devices Market. Manufacturers are increasingly prioritizing eco-friendly options that reduce environmental impact. This trend reflects a growing awareness of the need for responsible sourcing and production practices, which may lead to the development of biodegradable or recyclable packaging solutions.

Miniaturization of Power Devices

The trend of miniaturization is gaining traction within the New Packages Materials Power Devices Market. As technology advances, there is a demand for smaller, more efficient power devices that can deliver high performance in compact formats. This miniaturization not only enhances device portability but also allows for more versatile applications across various industries.

Integration of Smart Technologies

The integration of smart technologies into power devices is emerging as a key trend in the New Packages Materials Power Devices Market. This development suggests a move towards devices that can communicate and adapt to their environments, potentially improving efficiency and user experience. Such innovations may pave the way for smarter energy management systems.

New Packages Materials Power Devices Market Drivers

Market Growth Projections

The Global New Packages And Materials For Power Devices Market Industry is projected to experience robust growth over the coming years. With an estimated market value of 2.88 USD Billion in 2024, the industry is set to expand significantly, reaching approximately 6.78 USD Billion by 2035. This growth trajectory suggests a compound annual growth rate (CAGR) of 8.09% from 2025 to 2035, indicating a strong demand for innovative packaging solutions and materials that enhance the performance and efficiency of power devices across various sectors.

Increased Focus on Miniaturization

The trend towards miniaturization in electronic devices is a prominent factor affecting the Global New Packages And Materials For Power Devices Market Industry. As consumer electronics become smaller and more powerful, the need for compact and efficient packaging solutions is critical. Innovations in materials and design are enabling manufacturers to create smaller power devices without compromising performance. This shift is likely to enhance the market's growth trajectory, as companies invest in new packaging technologies that cater to the demand for miniaturized electronics across various applications.

Growing Demand for Energy Efficiency

The Global New Packages And Materials For Power Devices Market Industry is experiencing a surge in demand for energy-efficient solutions. As industries and consumers increasingly prioritize sustainability, the need for advanced packaging materials that enhance energy efficiency becomes paramount. For instance, the adoption of silicon carbide and gallium nitride technologies is on the rise, as these materials enable higher efficiency and lower energy losses. This trend is projected to contribute to the market's growth, with an estimated value of 2.88 USD Billion in 2024, reflecting a shift towards greener technologies across various sectors.

Rising Adoption of Electric Vehicles

The increasing adoption of electric vehicles (EVs) is a key driver for the Global New Packages And Materials For Power Devices Market Industry. As governments worldwide implement stricter emissions regulations, the demand for efficient power devices in EVs is escalating. Advanced packaging materials are essential for optimizing the performance of power electronics in these vehicles, ensuring longer battery life and improved efficiency. This trend is likely to propel the market forward, with an anticipated compound annual growth rate (CAGR) of 8.09% from 2025 to 2035, as manufacturers seek to enhance the capabilities of their EV systems.

Expansion of Renewable Energy Sources

The expansion of renewable energy sources is significantly influencing the Global New Packages And Materials For Power Devices Market Industry. As countries strive to meet renewable energy targets, the demand for efficient power devices that can handle variable energy sources is increasing. Advanced packaging materials play a crucial role in ensuring the reliability and efficiency of power electronics used in solar inverters and wind turbines. This growing emphasis on renewable energy is expected to drive market growth, with the industry poised for substantial advancements in packaging technologies to support this transition.

Technological Advancements in Power Electronics

Technological innovations in power electronics are driving the Global New Packages And Materials For Power Devices Market Industry forward. The development of new packaging techniques, such as embedded die and 3D packaging, allows for improved thermal management and miniaturization of devices. These advancements facilitate the integration of power devices into compact systems, which is essential for applications in electric vehicles and renewable energy systems. As a result, the market is expected to grow significantly, with projections indicating a value of 6.78 USD Billion by 2035, highlighting the importance of continuous innovation in this sector.

Market Segment Insights

By Application: Consumer Electronics (Largest) vs. Renewable Energy (Fastest-Growing)

The New Packages Materials Power Devices Market is diversely segmented into Consumer Electronics, Automotive, Industrial, Telecommunications, and Renewable Energy. Among these, Consumer Electronics stands out as the largest segment, driven by the continuous demand for advanced electronic devices and gadgets. This segment's significant contribution reflects the rapid technological advancements and the growth of the smart device market, which necessitates innovative packaging materials to enhance performance and efficiency. On the other hand, Renewable Energy is the fastest-growing segment within the market. The increasing focus on sustainable energy solutions and the transition towards green technologies have driven demand for efficient power devices in this sector. Factors such as government initiatives promoting renewable energy sources and technological advancements in energy storage are fueling this segment's growth, thereby shaping the overall dynamics of the New Packages Materials Power Devices Market.

Consumer Electronics: Dominant vs. Renewable Energy: Emerging

Consumer Electronics is the dominant application in the New Packages Materials Power Devices Market, characterized by a wide range of products such as smartphones, laptops, and wearable devices. This segment benefits from rapid innovation cycles and an ever-growing consumer base demanding lighter and more efficient packaging solutions that protect high-tech devices while minimizing environmental impact. In contrast, Renewable Energy represents an emerging application segment, where the demand for innovative packaging materials is driven by advancements in solar and wind energy technologies. The shift towards sustainable living is creating new opportunities in this sector, with manufacturers focusing on developing packaging that supports new energy technologies, such as lightweight composite materials that offer enhanced performance and durability.

By Material Type: Silicon (Largest) vs. Gallium Nitride (Fastest-Growing)

The New Packages Materials Power Devices Market showcases a diverse landscape in which Silicon remains the largest segment. Its time-tested reliability and cost-effectiveness make it a preferred choice for many applications. Other materials, such as Gallium Nitride and Silicon Carbide, have also carved out significant shares, attributed to their superior performance under high temperatures and voltages, making them crucial for advanced power solutions.

Silicon (Dominant) vs. Gallium Nitride (Emerging)

Silicon is the dominant material in the New Packages Materials Power Devices Market, celebrated for its maturity and extensive industrial adoption. Its ability to efficiently handle power electronics has secured its leading position. In contrast, Gallium Nitride is an emerging contender, praised for its efficiencies in high-frequency applications and energy savings. As the demand for faster and more efficient power devices grows, Gallium Nitride's market potential is on the rise, positioning it as a vital alternative to Silicon in future innovations.

By Device Type: Power Transistors (Largest) vs. Power Modules (Fastest-Growing)

The New Packages Materials Power Devices Market exhibits a diverse range of segments, with power transistors emerging as the largest category, capturing significant market interest due to their essential roles in various applications. Following closely are power modules, integrated circuits, diodes, and rectifiers, each contributing to the overall market landscape. The distribution reflects the increasing need for efficient power management and conversion solutions across sectors such as industrial, automotive, and consumer electronics. As the market evolves, growth trends indicate a robust demand for advanced power modules, which are witnessing rapid adoption attributed to their enhanced efficiency and compact designs. Integrated circuits are also gaining traction, driven by innovations in semiconductor technology. Additionally, the push towards renewable energy solutions is fostering growth among diodes and rectifiers, as they play vital roles in energy conversion and management systems.

Power Transistors (Dominant) vs. Power Modules (Emerging)

Power transistors stand out as the dominant force in the New Packages Materials Power Devices Market, primarily due to their versatility and reliability across a multitude of applications ranging from consumer electronics to industrial machinery. Their ability to effectively manage high voltages while maintaining energy efficiency is a crucial factor driving their adoption. In contrast, power modules are seen as an emerging segment, capturing market attention for their integrated solutions that simplify design complexity and enhance performance across various devices. The growing emphasis on miniaturization and efficiency in modern electronics positions power modules to quickly gain traction, appealing to manufacturers seeking to meet the demand for compact yet powerful energy solutions.

Get more detailed insights about New Packages Materials Power Devices Market

Regional Insights

North America : Market Leader in Innovation

North America is poised to maintain its leadership in the New Packages Materials Power Devices Market, holding a significant market share of 1.44B in 2025. The region's growth is driven by robust demand for advanced power management solutions, particularly in sectors like automotive and renewable energy. Regulatory support for clean energy initiatives further catalyzes market expansion, fostering innovation and investment in new technologies. The competitive landscape is characterized by major players such as Texas Instruments, ON Semiconductor, and Infineon Technologies, which are at the forefront of technological advancements. The U.S. and Canada are leading countries, with a strong focus on R&D and manufacturing capabilities. This concentration of expertise and resources positions North America as a hub for cutting-edge power device solutions.

Europe : Emerging Market with Potential

Europe is witnessing a growing interest in the New Packages Materials Power Devices Market, with a market size of 0.8B in 2025. The region's growth is fueled by increasing investments in renewable energy and electric vehicles, alongside stringent regulations aimed at reducing carbon emissions. The European Union's Green Deal and other initiatives are pivotal in driving demand for efficient power devices, enhancing sustainability across various sectors. Leading countries such as Germany, France, and the Netherlands are at the forefront of this market, supported by key players like STMicroelectronics and NXP Semiconductors. The competitive landscape is evolving, with a focus on innovation and collaboration among industry stakeholders. As Europe transitions towards a greener economy, the demand for advanced power devices is expected to rise significantly, creating new opportunities for growth.

Asia-Pacific : Rapid Growth and Development

Asia-Pacific is emerging as a significant player in the New Packages Materials Power Devices Market, with a market size of 0.48B in 2025. The region's growth is driven by rapid industrialization, urbanization, and increasing demand for consumer electronics. Countries like China and Japan are leading the charge, supported by government initiatives promoting energy efficiency and technological advancements in power devices. The competitive landscape features key players such as Mitsubishi Electric and Renesas Electronics, which are investing heavily in R&D to enhance product offerings. The presence of a robust manufacturing base and a growing middle class further bolster market potential. As the region continues to innovate and expand, the demand for advanced power devices is expected to rise, positioning Asia-Pacific as a vital market in the global landscape.

Middle East and Africa : Emerging Market Opportunities

The Middle East and Africa region is gradually emerging in the New Packages Materials Power Devices Market, with a market size of 0.16B in 2025. The growth is primarily driven by increasing investments in infrastructure and energy projects, alongside a rising demand for efficient power solutions. Governments in the region are focusing on diversifying their economies and investing in renewable energy, which is expected to boost the market for power devices significantly. Countries like South Africa and the UAE are leading the way, with a growing interest from international players looking to tap into this emerging market. The competitive landscape is still developing, but there is a clear trend towards collaboration and partnerships to enhance technological capabilities. As the region continues to evolve, the demand for innovative power devices is anticipated to grow, presenting new opportunities for market entrants.

Key Players and Competitive Insights

The New Packages Materials Power Devices Market is currently characterized by a dynamic competitive landscape, driven by rapid technological advancements and increasing demand for efficient power management solutions. Key players such as Infineon Technologies (DE), Texas Instruments (US), and STMicroelectronics (FR) are strategically positioned to leverage innovation and expand their market presence. Infineon Technologies (DE) focuses on enhancing its product portfolio through continuous R&D investments, while Texas Instruments (US) emphasizes localized manufacturing to optimize supply chains. STMicroelectronics (FR) is actively pursuing partnerships to bolster its capabilities in emerging markets, collectively shaping a competitive environment that is increasingly reliant on technological differentiation and strategic collaborations.

The market structure appears moderately fragmented, with several players vying for market share. Key business tactics include localizing manufacturing to reduce costs and enhance responsiveness to regional demands. Supply chain optimization remains a critical focus, as companies seek to mitigate risks and improve efficiency. The collective influence of these key players fosters a competitive atmosphere where innovation and operational excellence are paramount.

In November 2025, Infineon Technologies (DE) announced a strategic partnership with a leading automotive manufacturer to develop next-generation power modules aimed at electric vehicles (EVs). This collaboration is poised to enhance Infineon's position in the EV market, aligning with the growing trend towards electrification and sustainability. The partnership underscores the importance of innovation in meeting the evolving demands of the automotive sector.

In October 2025, Texas Instruments (US) unveiled a new line of power management ICs designed for industrial applications, showcasing its commitment to innovation and market responsiveness. This launch is significant as it addresses the increasing need for energy-efficient solutions in industrial settings, potentially expanding Texas Instruments' market share in this segment. The introduction of these products reflects a strategic focus on meeting customer needs through advanced technology.

In September 2025, STMicroelectronics (FR) expanded its manufacturing capabilities in Asia, aiming to enhance its supply chain resilience and meet the growing demand for power devices in the region. This expansion is strategically important as it positions STMicroelectronics to capitalize on the burgeoning market for power devices in Asia, where demand is expected to surge in the coming years. The move illustrates a proactive approach to regional market dynamics and supply chain optimization.

As of December 2025, current competitive trends indicate a strong emphasis on digitalization, sustainability, and AI integration within the New Packages Materials Power Devices Market. Strategic alliances are increasingly shaping the landscape, enabling companies to pool resources and expertise to drive innovation. Looking ahead, competitive differentiation is likely to evolve, with a shift from price-based competition to a focus on technological advancements, innovation, and supply chain reliability. This transition suggests that companies will need to prioritize R&D and strategic partnerships to maintain a competitive edge in an ever-evolving market.

Key Companies in the New Packages Materials Power Devices Market market include

Future Outlook

New Packages Materials Power Devices Market Future Outlook

The New Packages Materials Power Devices Market is projected to grow at a 9.4% CAGR from 2024 to 2035, driven by technological advancements and increasing demand for energy efficiency.

New opportunities lie in:

  • Development of advanced thermal management materials for high-performance devices.
  • Integration of smart packaging solutions to enhance device functionality.
  • Expansion into emerging markets with tailored product offerings.

By 2035, the market is expected to achieve substantial growth, positioning itself as a leader in innovative packaging solutions.

Market Segmentation

New Packages Materials Power Devices Market Application Outlook

  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Renewable Energy

New Packages Materials Power Devices Market Device Type Outlook

  • Power Transistors
  • Power Modules
  • Integrated Circuits
  • Diodes
  • Rectifiers

New Packages Materials Power Devices Market Material Type Outlook

  • Silicon
  • Gallium Nitride
  • Silicon Carbide
  • Organic Materials
  • Ceramics

Report Scope

MARKET SIZE 20242.88(USD Million)
MARKET SIZE 20253.15(USD Million)
MARKET SIZE 20357.74(USD Million)
COMPOUND ANNUAL GROWTH RATE (CAGR)9.4% (2024 - 2035)
REPORT COVERAGERevenue Forecast, Competitive Landscape, Growth Factors, and Trends
BASE YEAR2024
Market Forecast Period2025 - 2035
Historical Data2019 - 2024
Market Forecast UnitsUSD Million
Key Companies ProfiledInfineon Technologies (DE), Texas Instruments (US), STMicroelectronics (FR), ON Semiconductor (US), NXP Semiconductors (NL), Mitsubishi Electric (JP), Renesas Electronics (JP), Broadcom Inc. (US)
Segments CoveredApplication, Material Type, Device Type
Key Market OpportunitiesAdvancements in sustainable materials drive innovation in the New Packages Materials Power Devices Market.
Key Market DynamicsTechnological advancements in materials are driving innovation and competition in the New Packages Materials Power Devices Market.
Countries CoveredNorth America, Europe, APAC, South America, MEA

Market Highlights

Author
Aarti Dhapte
Team Lead - Research

She holds an experience of about 6+ years in Market Research and Business Consulting, working under the spectrum of Information Communication Technology, Telecommunications and Semiconductor domains. Aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. Her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

Leave a Comment

FAQs

How much is the New Packages And Materials For Power Devices Market?

The New Packages And Materials For Power Devices Market size is expected to be valued at USD 7.74 billion by 2035.

What is the growth rate of the New Packages And Materials For Power Devices Market?

The global market is projected to grow at a CAGR of 9.40% during the forecast period, 2025 to 2035.

Which region held the largest market share in the New Packages And Materials For Power Devices Market?

Asia Pacific had the largest share of the global market.

Who are the key players in the New Packages And Materials For Power Devices Market?

The key players in the market are Astec Industries Infineon Technologies, STMICROELECTRONICS, Texas Instruments, Mitsubishi Electric Corporation, Rohm Semiconductor, NXP Semiconductors N.V, Analog Devices, On Semiconductors, Microchip Technology, WOLFSPEED, Inc , And among others.

Which Product Type led the New Packages And Materials For Power Devices Market?

Silicon Carbide (Sic) dominated the market in 2024.

Which Application had the largest market share in the New Packages And Materials For Power Devices Market?

Automotive segment had the largest revenue share of the global market.

Download Free Sample

Kindly complete the form below to receive a free sample of this Report

Compare Licence

×
Features License Type
Single User Multiuser License Enterprise User
Price $4,950 $5,950 $7,250
Maximum User Access Limit 1 User Upto 10 Users Unrestricted Access Throughout the Organization
Free Customization
Direct Access to Analyst
Deliverable Format
Platform Access
Discount on Next Purchase 10% 15% 15%
Printable Versions