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Power Supply in Package Chip Market

ID: MRFR/SEM/6295-CR
101 Pages
Aarti Dhapte
May 2019

Power Supply in Package and Power Supply on Chip Market Research Report Information By Product (PSIP and PwrSoc), By Application (Medical Devices, Automotive, Consumer Electronics, Military and Defense, and Telecom and IT), and By Region (North America, Europe, Asia-Pacific, and Rest Of The World) – Market Forecast Till 2035

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Power Supply in Package Chip Market Infographic
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Power Supply in Package Chip Market Summary

As per MRFR analysis, the Power Supply in Package and Power Supply on Chip Market was estimated at 1.785 USD Billion in 2024. The market is projected to grow from 1.862 USD Billion in 2025 to 2.837 USD Billion by 2035, exhibiting a compound annual growth rate (CAGR) of 4.3 during the forecast period 2025 - 2035.

Key Market Trends & Highlights

The Power Supply in Package and Power Supply on Chip Market is experiencing robust growth driven by technological advancements and increasing demand across various sectors.

  • The integration of power management functions is becoming increasingly prevalent, enhancing efficiency in electronic devices.
  • Advancements in semiconductor technology are facilitating the development of more compact and powerful power supply solutions.
  • The automotive sector is witnessing a surge in demand for power supply solutions, particularly in electric vehicles and advanced driver-assistance systems.
  • Key market drivers include the integration of advanced power management solutions and the miniaturization of electronic components, particularly in North America and the Asia-Pacific region.

Market Size & Forecast

2024 Market Size 1.785 (USD Billion)
2035 Market Size 2.837 (USD Billion)
CAGR (2025 - 2035) 4.3%

Major Players

Texas Instruments (US), Analog Devices (US), Infineon Technologies (DE), STMicroelectronics (FR), NXP Semiconductors (NL), Maxim Integrated (US), Microchip Technology (US), Renesas Electronics (JP), ON Semiconductor (US)

Power Supply in Package Chip Market Trends

The Power Supply in Package and Power Supply on Chip Market is currently experiencing a notable evolution, driven by the increasing demand for compact and efficient power solutions across various sectors. This market encompasses advanced technologies that integrate power management functions into a single package or chip, thereby enhancing performance while minimizing space requirements. As electronic devices become more sophisticated, the need for reliable and high-performance power supplies is paramount. This trend is particularly evident in consumer electronics, automotive applications, and industrial automation, where efficiency and reliability are critical. Moreover, the ongoing advancements in semiconductor technology are likely to further propel the growth of this market. Innovations in materials and design methodologies are enabling the development of more efficient power supply solutions that can operate at higher frequencies and lower voltages. This shift not only improves energy efficiency but also reduces thermal management challenges, which are increasingly important in modern electronic systems. As the market continues to evolve, it appears poised to meet the growing demands of various industries, potentially leading to new applications and opportunities for growth.

Integration of Power Management Functions

The trend towards integrating power management functions into a single package or chip is gaining traction. This integration simplifies design processes and enhances overall system performance, making it particularly appealing for compact electronic devices.

Advancements in Semiconductor Technology

Ongoing advancements in semiconductor technology are likely to drive innovation in the Power Supply in Package and Power Supply on Chip Market. New materials and design techniques are enabling the creation of more efficient power solutions, which could lead to improved energy management.

Growing Demand in Automotive Sector

The automotive sector is increasingly adopting power supply solutions that offer enhanced efficiency and reliability. This trend is driven by the rise of electric vehicles and the need for sophisticated power management systems to support advanced driver-assistance technologies.

Power Supply in Package Chip Market Drivers

Growth in Renewable Energy Applications

The growth in renewable energy applications is emerging as a vital driver for the Power Supply in Package and Power Supply on Chip Market. As the world shifts towards sustainable energy sources, the demand for efficient power supply solutions that can support renewable technologies is increasing. This includes applications in solar inverters and wind energy systems, where reliable power supply is essential. The renewable energy market is projected to expand significantly, with investments expected to exceed 1 trillion USD by 2030. This trend indicates a substantial opportunity for power supply solutions that cater to the unique requirements of renewable energy systems, thereby fostering innovation and development within the industry.

Miniaturization of Electronic Components

The ongoing trend of miniaturization in electronic components significantly influences the Power Supply in Package and Power Supply on Chip Market. As devices shrink in size, the demand for compact and efficient power supply solutions increases. This miniaturization trend is particularly evident in consumer electronics, where space constraints necessitate smaller power supply units. The market for miniaturized power supplies is expected to grow at a compound annual growth rate of around 8% over the next five years. This growth is indicative of the industry's response to the need for smaller, more efficient power solutions that can fit into increasingly compact devices, thereby enhancing overall functionality.

Rising Demand for Energy-Efficient Solutions

The rising demand for energy-efficient solutions is a prominent driver in the Power Supply in Package and Power Supply on Chip Market. With increasing awareness of environmental issues and energy costs, manufacturers are focusing on developing power supplies that minimize energy waste. The energy-efficient power supply market is anticipated to grow significantly, with estimates suggesting a market size of over 30 billion USD by 2025. This shift towards energy efficiency not only aligns with regulatory requirements but also appeals to consumers seeking sustainable products. Consequently, the industry is likely to see a surge in innovations aimed at enhancing energy efficiency in power supply designs.

Integration of Advanced Power Management Solutions

The integration of advanced power management solutions is a key driver for the Power Supply in Package and Power Supply on Chip Market. As electronic devices become increasingly complex, the need for efficient power management has surged. This integration allows for reduced power consumption and enhanced performance, which is crucial in applications such as mobile devices and IoT. The market for power management ICs is projected to reach approximately 50 billion USD by 2026, indicating a robust growth trajectory. This trend is likely to propel the demand for power supply solutions that can seamlessly integrate with these advanced power management systems, thereby driving innovation and competition within the industry.

Technological Advancements in Semiconductor Manufacturing

Technological advancements in semiconductor manufacturing are driving the evolution of the Power Supply in Package and Power Supply on Chip Market. Innovations such as 3D packaging and advanced fabrication techniques are enabling the production of more efficient and compact power supply solutions. These advancements not only enhance performance but also reduce costs, making power supplies more accessible to a broader range of applications. The semiconductor manufacturing market is expected to grow at a CAGR of approximately 7% over the next few years, reflecting the increasing demand for advanced power supply technologies. This growth is likely to stimulate further research and development in the power supply sector, leading to enhanced product offerings.

Market Segment Insights

Power Supply in Package and Power Supply on Chip Product Insights

The Power Supply in Package and Power Supply on Chip Market segmentation, based on product, includes PSIP and PwrSoc. PSIP segment accounted for the largest revenue share in 2022. This may be connected to the increase in packaged power supply requirements.

Power Supply in Package and Power Supply on Chip Application Insights

The Power Supply in Package and Power Supply on Chip Market segmentation, based on application, includes medical devices, automotive, consumer electronics, military and defense, and telecom and IT. Automotive segment dominated the Power Supply in Package and Power Supply on Chip Market in 2022. This is a result of rising PSIP and PwrSoc demand in the automotive industry.

Figure 1: Power Supply in Package and Power Supply on Chip Market, by Application, 2022 & 2032 (USD Billion)

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Get more detailed insights about Power Supply in Package Chip Market

Regional Insights

North America : Innovation and Demand Surge

North America is the largest market for Power Supply in Package and Power Supply on Chip, holding approximately 40% of the global market share. The region's growth is driven by increasing demand for advanced electronics, automotive applications, and renewable energy solutions. Regulatory support for energy efficiency and sustainability initiatives further catalyzes market expansion, making it a key player in the global landscape. The United States leads the market, with significant contributions from Canada and Mexico. Major players like Texas Instruments, Analog Devices, and ON Semiconductor dominate the competitive landscape, leveraging advanced technologies and innovation. The presence of robust research and development facilities enhances the region's capability to meet evolving consumer demands, ensuring a strong foothold in the global market.

Europe : Regulatory Framework and Innovation

Europe is the second-largest market for Power Supply in Package and Power Supply on Chip, accounting for around 30% of the global market share. The region's growth is propelled by stringent regulations aimed at energy efficiency and sustainability, alongside a rising demand for electric vehicles and smart grid technologies. The European Union's Green Deal and various national initiatives are pivotal in shaping the market dynamics, fostering innovation and investment in clean energy solutions. Germany, France, and the Netherlands are the leading countries in this sector, with a competitive landscape featuring key players like Infineon Technologies and STMicroelectronics. The presence of a strong manufacturing base and a focus on research and development further enhance the region's capabilities. Collaborative efforts between industry and academia are driving advancements, ensuring Europe remains at the forefront of power supply technology.

Asia-Pacific : Emerging Markets and Growth Potential

Asia-Pacific is witnessing rapid growth in the Power Supply in Package and Power Supply on Chip market, holding approximately 25% of the global market share. The region's expansion is driven by increasing consumer electronics demand, industrial automation, and the rise of electric vehicles. Government initiatives promoting smart manufacturing and renewable energy adoption are also significant catalysts for market growth, positioning Asia-Pacific as a key player in the global landscape. China, Japan, and South Korea are the leading countries in this market, with a competitive environment featuring major players like Renesas Electronics and NXP Semiconductors. The region benefits from a robust supply chain and manufacturing capabilities, enabling it to meet the growing demand for advanced power solutions. Investments in research and development are fostering innovation, ensuring that Asia-Pacific remains competitive in the global arena.

Middle East and Africa : Resource-Rich and Emerging Markets

The Middle East and Africa region is emerging in the Power Supply in Package and Power Supply on Chip market, holding about 5% of the global market share. The growth is driven by increasing investments in infrastructure, energy projects, and a rising demand for consumer electronics. Government initiatives aimed at diversifying economies and enhancing energy efficiency are also contributing to market development, making this region a potential growth frontier in the coming years. Countries like South Africa, UAE, and Saudi Arabia are leading the market, with a competitive landscape that includes both local and international players. The presence of key companies and investments in technology are fostering innovation and development. As the region continues to invest in renewable energy and smart technologies, it is poised for significant growth in the power supply sector.

Power Supply in Package Chip Market Regional Image

Key Players and Competitive Insights

Leading market players are investing heavily in research and development in order to expand their product lines, which will help the Power Supply in Package and Power Supply on Chip market, grow even more. Market participants are also undertaking a variety of strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, Power Supply in Package and Power Supply on Chip industry must offer cost-effective items.

Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global Power Supply in Package and Power Supply on Chip industry to benefit clients and increase the market sector. In recent years, the Power Supply in Package and Power Supply on Chip industry has offered some of the most significant advantages to medicine. Major players in the Power Supply in Package and Power Supply on Chip market, including Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co.

Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group, are attempting to increase market demand by investing in research and development operations.

Fuji Electric Co Ltd (Fuji Electric) manufactures electrical goods. Among its commercial operations are the production of thermal, geothermal, and hydraulic power as well as nuclear power-related equipment, solar power generation systems, energy management systems, watt-hour metres, and information systems. Additionally, the company offers factory energy management systems, industrial drive systems, heating and induction furnace equipment, transmission and distribution equipment, industrial power supply equipment, data centres, clean room facilities, plant control systems, measurement systems, and radiation monitoring systems.

Additionally, Fuji Electric provides installation services for motors, inverter/servo systems, electric vehicle (EV) systems, transport systems, and uninterruptible power supply (UPS) systems, in addition to electrical and HVAC equipment. The company operates in North America, Europe, and Asia. Shinagawa-ku, Tokyo, Japan, is where Fuji Electric's corporate offices are situated. In August 2019, Fuji Electric Co., Ltd. expanded its X series of IGBT*1 modules, which are aimed at the market for large-scale wind power generation. The 1700V product has already begun shipping samples.

Panasonic Holdings Corp. (Panasonic), formerly known as Panasonic Corp., is a global manufacturer, retailer, and service provider of a wide range of electric and electronic products. Individual room air conditioners, TVs, landlines, digital cameras, home audio and video equipment, rice cookers, lamps, wiring devices, air conditioners, air purifiers, and bicycles are just a few of the things Panasonic offers. In addition, it sells PCs, tablets, batteries, electric motors, mounting machines, semiconductors, LCD panels, electronic materials, electronic components, and electronic materials. The company manages and operates facilities and R&D locations in Europe, Asia, the Americas, and Japan.

Panasonic's corporate headquarters are in Kadoma-shi in the Japanese city of Osaka.

Key Companies in the Power Supply in Package Chip Market market include

Industry Developments

January 2018: Mitsubishi Electric Corporation disclosed its research into 6.5kV full SiC power semiconductor modules. This power module offers the other power semiconductor modules' maximum power density.

Future Outlook

Power Supply in Package Chip Market Future Outlook

The Power Supply in Package and Power Supply on Chip Market is projected to grow at a 4.3% CAGR from 2024 to 2035, driven by advancements in semiconductor technology and increasing demand for energy efficiency.

New opportunities lie in:

  • Development of integrated power management ICs for IoT devices.
  • Expansion into renewable energy applications for sustainable power solutions.
  • Partnerships with automotive manufacturers for electric vehicle power systems.

By 2035, the market is expected to achieve robust growth, reflecting evolving technological demands.

Market Segmentation

Power Supply in Package Chip Market Product Outlook

  • PSIP
  • PwrSoc

Power Supply in Package Chip Market Application Outlook

  • Medical Devices
  • Automotive
  • Consumer Electronics
  • Military and Defense
  • Telecom and IT

Report Scope

MARKET SIZE 20241.785(USD Billion)
MARKET SIZE 20251.862(USD Billion)
MARKET SIZE 20352.837(USD Billion)
COMPOUND ANNUAL GROWTH RATE (CAGR)4.3% (2024 - 2035)
REPORT COVERAGERevenue Forecast, Competitive Landscape, Growth Factors, and Trends
BASE YEAR2024
Market Forecast Period2025 - 2035
Historical Data2019 - 2024
Market Forecast UnitsUSD Billion
Key Companies ProfiledMarket analysis in progress
Segments CoveredMarket segmentation analysis in progress
Key Market OpportunitiesIntegration of advanced semiconductor technologies enhances efficiency in the Power Supply in Package and Power Supply on Chip Market.
Key Market DynamicsTechnological advancements drive competition in Power Supply in Package and Power Supply on Chip, enhancing efficiency and integration.
Countries CoveredNorth America, Europe, APAC, South America, MEA

Market Highlights

Author
Aarti Dhapte
Team Lead - Research

She holds an experience of about 6+ years in Market Research and Business Consulting, working under the spectrum of Information Communication Technology, Telecommunications and Semiconductor domains. Aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. Her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

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FAQs

What is the projected market valuation for the Power Supply in Package and Power Supply on Chip Market by 2035?

The projected market valuation for the Power Supply in Package and Power Supply on Chip Market is 2.837 USD Billion by 2035.

What was the overall market valuation in 2024 for the Power Supply in Package and Power Supply on Chip Market?

The overall market valuation for the Power Supply in Package and Power Supply on Chip Market was 1.785 USD Billion in 2024.

What is the expected CAGR for the Power Supply in Package and Power Supply on Chip Market during the forecast period 2025 - 2035?

The expected CAGR for the Power Supply in Package and Power Supply on Chip Market during the forecast period 2025 - 2035 is 4.3%.

Which companies are considered key players in the Power Supply in Package and Power Supply on Chip Market?

Key players in the market include Texas Instruments, Analog Devices, Infineon Technologies, STMicroelectronics, NXP Semiconductors, Maxim Integrated, Microchip Technology, Renesas Electronics, and ON Semiconductor.

What are the projected valuations for the Power Supply in Package segment by 2035?

The projected valuation for the Power Supply in Package segment is expected to reach 1.418 USD Billion by 2035.

How does the Power Supply on Chip segment compare in valuation to the Power Supply in Package segment by 2035?

By 2035, the Power Supply on Chip segment is projected to have a valuation of 1.419 USD Billion, slightly higher than the Power Supply in Package segment.

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