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    Power Supply in Package Chip Market

    ID: MRFR/SEM/6295-CR
    101 Pages
    Aarti Dhapte
    May 2019

    Power Supply in Package and Power Supply on Chip Market Research Report Information By Product (PSIP and PwrSoc), By Application (Medical Devices, Automotive, Consumer Electronics, Military and Defense, and Telecom and IT), and By Region (North America, Europe, Asia-Pacific, and Rest Of The World) – Market Forecast Till 2032

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    Power Supply in Package Chip Market Infographic
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    Power Supply in Package Chip Market Summary

    As per Market Research Future Analysis, the Global Power Supply in Package and Power Supply on Chip Market was valued at USD 1.7 Billion in 2023 and is projected to reach USD 2.5 Billion by 2032, growing at a CAGR of 4.30% from 2024 to 2032. Key drivers include the increasing adoption of automation systems and the expansion of the telecommunications sector, which require efficient power supply solutions. The market is witnessing a shift towards miniaturization and integration of power supply technologies, driven by advancements in semiconductor and packaging technologies. The automotive sector is the largest application area, while North America holds the dominant market share.

    Key Market Trends & Highlights

    The market is experiencing significant growth driven by automation and telecommunications.

    • Market Size in 2023: USD 1.7 Billion
    • Projected Market Size by 2032: USD 2.5 Billion
    • CAGR from 2024 to 2032: 4.30%
    • Largest Application Segment: Automotive in 2022

    Market Size & Forecast

    2023 Market Size USD 1.7 Billion
    2024 Market Size USD 1.785 Billion
    2032 Market Size USD 2.5 Billion
    CAGR (2024-2032) 4.30%

    Major Players

    Key players include Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group.

    Power Supply in Package Chip Market Trends

    The growing adoption of automation systems the market growth

    The growing deployment of automation systems is one of the main drivers of the power supply in package and power supply on chip sectors. A market trend that is now emerging is automation. Offices and residences are both embracing automation. This automated technology may reduce the requirement for human intervention. Every task is streamlined and made simpler. However, a lot of energy might be consumed by these automated devices. An effective voltage control system is needed in electronic automation systems. The rising demand for these automation technologies will be advantageous to the industry.

    The rise of the power supply in packages and power supply on chips is spectacular as a result of these market dynamics.

    Semiconductor enterprises have been addressing power supply miniaturisation more and more in recent years thanks to their ability to generate cutting-edge processing and functional product formats like power supply-in-package (PSiP) and power supply-on-chip (PwrSoC).- Become more integrated.

    This rise in the number of functionally integrated hardware products marks a turning point for the power supply industry, which is moving sharply away from traditional power supply manufacturing (with a focus on the assembly of power supply modules or bricks from discrete components) and towards a growing emphasis on power supply products delivered directly from the semiconductor and microelectronics industries.- Look for new gear and software. This trend will be made possible by improvements in semiconductor, magnetic, capacitor, and packaging materials and technologies, which will lead to products that function at several MHz frequencies.

    The rising use of data centres will present opportunities for market expansion. A vast number of data centres are anticipated in the upcoming years. Data centres will be used for a variety of purposes in the upcoming years. These centres have a big demand for organising and keeping data. The increased utilisation of power supply in data centres will present significant opportunities.

    Thus, driving the Power Supply in Package and Power Supply on Chip market revenue.

    The ongoing evolution of power supply technologies, particularly in the realms of Power Supply in Package and Power Supply on Chip, appears to be driven by the increasing demand for energy efficiency and miniaturization in electronic devices.

    U.S. Department of Energy

    Power Supply in Package Chip Market Drivers

    Growing Demand for Miniaturization

    The trend towards miniaturization in electronics is a primary driver for the Global Power Supply in Package and Power Supply on Chip Market Industry. As devices become smaller, the need for compact power solutions increases. This trend is evident in sectors such as consumer electronics, where manufacturers seek to integrate more functionality into smaller form factors. For instance, smartphones and wearables require efficient power management solutions that do not compromise on performance. The market is projected to reach 1.78 USD Billion in 2024, reflecting the industry's response to this demand for miniaturized power solutions.

    Market Segment Insights

    Power Supply in Package and Power Supply on Chip Product Insights

    The Power Supply in Package and Power Supply on Chip Market segmentation, based on product, includes PSIP and PwrSoc. PSIP segment accounted for the largest revenue share in 2022. This may be connected to the increase in packaged power supply requirements.

    Power Supply in Package and Power Supply on Chip Application Insights

    The Power Supply in Package and Power Supply on Chip Market segmentation, based on application, includes medical devices, automotive, consumer electronics, military and defense, and telecom and IT. Automotive segment dominated the Power Supply in Package and Power Supply on Chip Market in 2022. This is a result of rising PSIP and PwrSoc demand in the automotive industry.

    Figure 1: Power Supply in Package and Power Supply on Chip Market, by Application, 2022 & 2032 (USD Billion)

    Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

    Get more detailed insights about Power Supply in Package and Power Supply on Chip Market Research Report - Forecast 2032

    Regional Insights

    By region, the study provides the market insights into North America, Europe, Asia-Pacific and Rest of the World. The North America Power Supply in Package and Power Supply on Chip Market dominated this market in 2022 (45.80%). PSIP has a great deal of potential in this area. In this industry, there are also less cost barriers. The market for consumer electronics will be very large. Further, the U.S.

    Power Supply in Package and Power Supply on Chip market held the largest market share, and the Canada Power Supply in Package and Power Supply on Chip market was the fastest growing market in the North America region.

    Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.

    Figure 2: Power Supply in Package and Power Supply on Chip Market SHARE BY REGION 2022 (USD Billion)

    Power Supply in Package and Power Supply on Chip Market SHARE BY REGION 2022

    Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

    Europe Power Supply in Package and Power Supply on Chip market accounted for the healthy market share in 2022. In the UK and Germany, PSIP will be utilised more frequently during the projection period. Further, the German Power Supply in Package and Power Supply on Chip market held the largest market share, and the U.K Power Supply in Package and Power Supply on Chip market was the fastest growing market in the European region.

    The Asia Pacific Power Supply in Package and Power Supply on Chip market is expected to register significant growth from 2023 to 2032. The manufacturing and medical device industries will have a particularly strong demand for this product. Additionally, countries like China, Japan, and India will diversify their product lines. Moreover, China’s Power Supply in Package and Power Supply on Chip market held the largest market share, and the Indian Power Supply in Package and Power Supply on Chip market was the fastest growing market in the Asia-Pacific region.

    Key Players and Competitive Insights

    Leading market players are investing heavily in research and development in order to expand their product lines, which will help the Power Supply in Package and Power Supply on Chip market, grow even more. Market participants are also undertaking a variety of strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, Power Supply in Package and Power Supply on Chip industry must offer cost-effective items.

    Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global Power Supply in Package and Power Supply on Chip industry to benefit clients and increase the market sector. In recent years, the Power Supply in Package and Power Supply on Chip industry has offered some of the most significant advantages to medicine. Major players in the Power Supply in Package and Power Supply on Chip market, including Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co.

    Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group, are attempting to increase market demand by investing in research and development operations.

    Fuji Electric Co Ltd (Fuji Electric) manufactures electrical goods. Among its commercial operations are the production of thermal, geothermal, and hydraulic power as well as nuclear power-related equipment, solar power generation systems, energy management systems, watt-hour metres, and information systems. Additionally, the company offers factory energy management systems, industrial drive systems, heating and induction furnace equipment, transmission and distribution equipment, industrial power supply equipment, data centres, clean room facilities, plant control systems, measurement systems, and radiation monitoring systems.

    Additionally, Fuji Electric provides installation services for motors, inverter/servo systems, electric vehicle (EV) systems, transport systems, and uninterruptible power supply (UPS) systems, in addition to electrical and HVAC equipment. The company operates in North America, Europe, and Asia. Shinagawa-ku, Tokyo, Japan, is where Fuji Electric's corporate offices are situated. In August 2019, Fuji Electric Co., Ltd. expanded its X series of IGBT*1 modules, which are aimed at the market for large-scale wind power generation. The 1700V product has already begun shipping samples.

    Panasonic Holdings Corp. (Panasonic), formerly known as Panasonic Corp., is a global manufacturer, retailer, and service provider of a wide range of electric and electronic products. Individual room air conditioners, TVs, landlines, digital cameras, home audio and video equipment, rice cookers, lamps, wiring devices, air conditioners, air purifiers, and bicycles are just a few of the things Panasonic offers. In addition, it sells PCs, tablets, batteries, electric motors, mounting machines, semiconductors, LCD panels, electronic materials, electronic components, and electronic materials. The company manages and operates facilities and R&D locations in Europe, Asia, the Americas, and Japan.

    Panasonic's corporate headquarters are in Kadoma-shi in the Japanese city of Osaka.

    Key Companies in the Power Supply in Package Chip Market market include

    Industry Developments

    January 2018: Mitsubishi Electric Corporation disclosed its research into 6.5kV full SiC power semiconductor modules. This power module offers the other power semiconductor modules' maximum power density.

    Future Outlook

    Power Supply in Package Chip Market Future Outlook

    The Power Supply in Package and Power Supply on Chip Market is projected to grow at a 4.3% CAGR from 2024 to 2035, driven by advancements in semiconductor technology and increasing demand for energy efficiency.

    New opportunities lie in:

    • Develop integrated power management solutions for IoT devices to enhance energy efficiency.
    • Invest in R&D for miniaturized power supply solutions targeting automotive applications.
    • Explore partnerships with renewable energy firms to create sustainable power supply systems.

    By 2035, the market is expected to achieve substantial growth, reflecting evolving technological demands and sustainability initiatives.

    Market Segmentation

    Power Supply in Package and Power Supply on Chip Product Outlook

    • PSIP
    • PwrSoc

    Power Supply in Package and Power Supply on Chip Regional Outlook

    • US
    • Canada

    Power Supply in Package and Power Supply on Chip Application Outlook

    • Medical Devices
    • Automotive
    • Consumer Electronics
    • Military and Defense
    • Telecom and IT

    Report Scope

    Report Attribute/Metric Details
    Market Size 2023 USD 1.7 Billion
    Market Size 2024 USD 1.785 Billion
    Market Size 2032 USD 2.5 Billion
    Compound Annual Growth Rate (CAGR) 4.30% (2024-2032)
    Base Year 2023
    Market Forecast Period 2024-2032
    Historical Data 2018- 2022
    Market Forecast Units Value (USD Billion)
    Report Coverage Revenue Forecast, Market Competitive Landscape, Growth Factors, and Trends
    Segments Covered Product, Application, and Region
    Geographies Covered North America, Europe, Asia Pacific, and the Rest of the World
    Countries Covered The U.S., Canada, German, France, U.K, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil
    Key Companies Profiled Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group
    Key Market Opportunities Growing use in data centers
    Key Market Dynamics The growing adoption of automation systems and the emerging telecommunication sectors

    Market Highlights

    Author
    Aarti Dhapte
    Team Lead - Research

    She holds an experience of about 6+ years in Market Research and Business Consulting, working under the spectrum of Information Communication Technology, Telecommunications and Semiconductor domains. Aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. Her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

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    FAQs

    How much is the Power Supply in Package and Power Supply on Chip market?

    The Power Supply in Package and Power Supply on Chip Market size was valued at USD 1.7 Billion in 2023.

    What is the growth rate of the Power Supply in Package and Power Supply on Chip market?

    The global market is projected to grow at a CAGR of 4.30% during the forecast period, 2024-2032.

    Which region held the largest market share in the Power Supply in Package and Power Supply on Chip market?

    North America had the largest share in the global market

    Who are the key players in the Power Supply in Package and Power Supply on Chip market?

    The key players in the market are Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group

    Which Product led the Power Supply in Package and Power Supply on Chip market?

    The PSIP Product dominated the market in 2022.

    Which Application had the largest market share in the Power Supply in Package and Power Supply on Chip market?

    The Automotive Application had the largest share in the global market.

    Power Supply in Package and Power Supply on Chip Market Research Report - Forecast 2032 Infographic
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