US Automotive PCB Market

ID: MRFR/AT/16702-HCR
100 Pages
Triveni Bhoyar
Last Updated: April 06, 2026
US Automotive PCB Market Research Report By Type (Single or Double Layer, Multi-Layer, High-Density Interconnect, Flexible PCB, Others) and By Application (ADAS, Body & Comfort, Infotainment, Others) - Forecast to 2035
US Automotive PCB Market
Market Size
Forecast Period2025 - 2035
CAGR (2025 - 2035)5.28%
2024 Market Size$ 1,033.5 Million
2025 Market Size$ 1,088.07 Million
2035 Market Size$ 1,820.55 Million
Key Players
Rohm Semiconductor
Texas Instruments
Infineon Technologies
NXP Semiconductors
STMicroelectronics
ON Semiconductor
Trends
  • Rise of Electric Vehicles
  • Integration of Advanced Driver Assistance Systems (ADAS)
  • Focus on Lightweight and Sustainable Materials
Opportunities
  • Rise of Autonomous Driving Technologies
  • Growing Demand for Connectivity Solutions
  • Increased Focus on Vehicle Electrification
Summary Table of Contents Segmentation Download PDF
  1. 1 SECTION I: EXECUTIVE SUMMARY AND KEY HIGHLIGHTS
    1. 1.1 EXECUTIVE SUMMARY
      1. 1.1.1 Market Overview
      2. 1.1.2 Key Findings
      3. 1.1.3 Market Segmentation
      4. 1.1.4 Competitive Landscape
      5. 1.1.5 Challenges and Opportunities
      6. 1.1.6 Future Outlook
  2. 2 SECTION II: SCOPING, METHODOLOGY AND MARKET STRUCTURE
    1. 2.1 MARKET INTRODUCTION
      1. 2.1.1 Definition
      2. 2.1.2 Scope of the study
        1. 2.1.2.1 Research Objective
        2. 2.1.2.2 Assumption
        3. 2.1.2.3 Limitations
    2. 2.2 RESEARCH METHODOLOGY
      1. 2.2.1 Overview
      2. 2.2.2 Data Mining
      3. 2.2.3 Secondary Research
      4. 2.2.4 Primary Research
        1. 2.2.4.1 Primary Interviews and Information Gathering Process
        2. 2.2.4.2 Breakdown of Primary Respondents
      5. 2.2.5 Forecasting Model
      6. 2.2.6 Market Size Estimation
        1. 2.2.6.1 Bottom-Up Approach
        2. 2.2.6.2 Top-Down Approach
      7. 2.2.7 Data Triangulation
      8. 2.2.8 Validation
  3. 3 SECTION III: QUALITATIVE ANALYSIS
    1. 3.1 MARKET DYNAMICS
      1. 3.1.1 Overview
      2. 3.1.2 Drivers
      3. 3.1.3 Restraints
      4. 3.1.4 Opportunities
    2. 3.2 MARKET FACTOR ANALYSIS
      1. 3.2.1 Value chain Analysis
      2. 3.2.2 Porter's Five Forces Analysis
        1. 3.2.2.1 Bargaining Power of Suppliers
        2. 3.2.2.2 Bargaining Power of Buyers
        3. 3.2.2.3 Threat of New Entrants
        4. 3.2.2.4 Threat of Substitutes
        5. 3.2.2.5 Intensity of Rivalry
      3. 3.2.3 COVID-19 Impact Analysis
        1. 3.2.3.1 Market Impact Analysis
        2. 3.2.3.2 Regional Impact
        3. 3.2.3.3 Opportunity and Threat Analysis
  4. 4 SECTION IV: QUANTITATIVE ANALYSIS
    1. 4.1 Automobile, BY Type (USD Million)
      1. 4.1.1 Single or Double Layer
      2. 4.1.2 Multi-Layer
      3. 4.1.3 High-Density Interconnect
      4. 4.1.4 Flexible PCB
      5. 4.1.5 Others
    2. 4.2 Automobile, BY Application (USD Million)
      1. 4.2.1 ADAS
      2. 4.2.2 Body & Comfort
      3. 4.2.3 Infotainment
      4. 4.2.4 Others
  5. 5 SECTION V: COMPETITIVE ANALYSIS
    1. 5.1 Competitive Landscape
      1. 5.1.1 Overview
      2. 5.1.2 Competitive Analysis
      3. 5.1.3 Market share Analysis
      4. 5.1.4 Major Growth Strategy in the Automobile
      5. 5.1.5 Competitive Benchmarking
      6. 5.1.6 Leading Players in Terms of Number of Developments in the Automobile
      7. 5.1.7 Key developments and growth strategies
        1. 5.1.7.1 New Product Launch/Service Deployment
        2. 5.1.7.2 Merger & Acquisitions
        3. 5.1.7.3 Joint Ventures
      8. 5.1.8 Major Players Financial Matrix
        1. 5.1.8.1 Sales and Operating Income
        2. 5.1.8.2 Major Players R&D Expenditure. 2023
    2. 5.2 Company Profiles
      1. 5.2.1 Rohm Semiconductor (JP)
        1. 5.2.1.1 Financial Overview
        2. 5.2.1.2 Products Offered
        3. 5.2.1.3 Key Developments
        4. 5.2.1.4 SWOT Analysis
        5. 5.2.1.5 Key Strategies
      2. 5.2.2 Texas Instruments (US)
        1. 5.2.2.1 Financial Overview
        2. 5.2.2.2 Products Offered
        3. 5.2.2.3 Key Developments
        4. 5.2.2.4 SWOT Analysis
        5. 5.2.2.5 Key Strategies
      3. 5.2.3 Infineon Technologies (DE)
        1. 5.2.3.1 Financial Overview
        2. 5.2.3.2 Products Offered
        3. 5.2.3.3 Key Developments
        4. 5.2.3.4 SWOT Analysis
        5. 5.2.3.5 Key Strategies
      4. 5.2.4 NXP Semiconductors (NL)
        1. 5.2.4.1 Financial Overview
        2. 5.2.4.2 Products Offered
        3. 5.2.4.3 Key Developments
        4. 5.2.4.4 SWOT Analysis
        5. 5.2.4.5 Key Strategies
      5. 5.2.5 STMicroelectronics (CH)
        1. 5.2.5.1 Financial Overview
        2. 5.2.5.2 Products Offered
        3. 5.2.5.3 Key Developments
        4. 5.2.5.4 SWOT Analysis
        5. 5.2.5.5 Key Strategies
      6. 5.2.6 ON Semiconductor (US)
        1. 5.2.6.1 Financial Overview
        2. 5.2.6.2 Products Offered
        3. 5.2.6.3 Key Developments
        4. 5.2.6.4 SWOT Analysis
        5. 5.2.6.5 Key Strategies
      7. 5.2.7 Microchip Technology (US)
        1. 5.2.7.1 Financial Overview
        2. 5.2.7.2 Products Offered
        3. 5.2.7.3 Key Developments
        4. 5.2.7.4 SWOT Analysis
        5. 5.2.7.5 Key Strategies
      8. 5.2.8 Analog Devices (US)
        1. 5.2.8.1 Financial Overview
        2. 5.2.8.2 Products Offered
        3. 5.2.8.3 Key Developments
        4. 5.2.8.4 SWOT Analysis
        5. 5.2.8.5 Key Strategies
    3. 5.3 Appendix
      1. 5.3.1 References
      2. 5.3.2 Related Reports
  6. 6 LIST OF FIGURES
    1. 6.1 MARKET SYNOPSIS
    2. 6.2 US MARKET ANALYSIS BY TYPE
    3. 6.3 US MARKET ANALYSIS BY APPLICATION
    4. 6.4 KEY BUYING CRITERIA OF AUTOMOBILE
    5. 6.5 RESEARCH PROCESS OF MRFR
    6. 6.6 DRO ANALYSIS OF AUTOMOBILE
    7. 6.7 DRIVERS IMPACT ANALYSIS: AUTOMOBILE
    8. 6.8 RESTRAINTS IMPACT ANALYSIS: AUTOMOBILE
    9. 6.9 SUPPLY / VALUE CHAIN: AUTOMOBILE
    10. 6.10 AUTOMOBILE, BY TYPE, 2024 (% SHARE)
    11. 6.11 AUTOMOBILE, BY TYPE, 2024 TO 2035 (USD Million)
    12. 6.12 AUTOMOBILE, BY APPLICATION, 2024 (% SHARE)
    13. 6.13 AUTOMOBILE, BY APPLICATION, 2024 TO 2035 (USD Million)
    14. 6.14 BENCHMARKING OF MAJOR COMPETITORS
  7. 7 LIST OF TABLES
    1. 7.1 LIST OF ASSUMPTIONS
  8. 7.1.1
    1. 7.2 US MARKET SIZE ESTIMATES; FORECAST
      1. 7.2.1 BY TYPE, 2025-2035 (USD Million)
      2. 7.2.2 BY APPLICATION, 2025-2035 (USD Million)
    2. 7.3 PRODUCT LAUNCH/PRODUCT DEVELOPMENT/APPROVAL
  9. 7.3.1
    1. 7.4 ACQUISITION/PARTNERSHIP
  10. 7.4.1

US Automotive PCB Market Segmentation

US Automotive PCB Market By Type (USD Million, 2025-2035)

  • Single or Double Layer
  • Multi-Layer
  • High-Density Interconnect
  • Flexible PCB
  • Others

US Automotive PCB Market By Application (USD Million, 2025-2035)

  • ADAS
  • Body & Comfort
  • Infotainment
  • Others

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