United States Flexible Printed Circuit Board Industry Research Report to 2032

US Flexible Printed Circuit Board Industry Highlights & Dynamics

The dominant segment in the flexible printed circuit board (FPCB) market in 2017 was the multilayer flex segment, capturing the largest market share at 40.7%, equivalent to a market value of USD 1,135.07 million. This segment is anticipated to maintain robust growth, with an expected Compound Annual Growth Rate (CAGR) of 13.1% during the forecast period. Following closely, the rigid flex segment held the second-largest market share in 2017, valued at USD 771.15 million, and is projected to register the highest CAGR of 14.3%. In terms of regional market dynamics, the United States dominated in 2017, commanding an impressive 84.0% of the market share with a value of USD 2,786.56 million. The U.S. market is anticipated to continue its growth trajectory with a forecasted CAGR of 13.5%. Meanwhile, Canada emerged as the second-largest market in 2017, valued at USD 326.34 million, and is expected to register the highest CAGR among regions, reaching 16.3%. Analyzing market segments by application areas, the consumer electronics sector took the lead in 2017, claiming the largest market share at 35.9%, equivalent to a market value of USD 1,000.61 million.

This segment is anticipated to continue growing at a CAGR of 12.6% during the forecast period. Following closely, the manufacturing segment secured the second-largest market share in 2017, valued at USD 390.45 million, with a projected CAGR of 12.6%. Notably, the automotive segment is expected to outpace others, registering the highest CAGR of 16.3%. In summary, the FPCB market is marked by the dominance of the multilayer flex segment, showcasing its significance in the industry. Regionally, the United States stands out as the major contributor to market value, while Canada is projected to experience the highest growth rate. In terms of applications, consumer electronics continue to lead the market, closely followed by the manufacturing sector, with the automotive segment expected to exhibit the highest growth rate among them. The market's overall trajectory suggests significant opportunities and growth potential, especially in segments such as rigid flex and automotive applications.

Report Attribute/Metric	Details
Market Size 2030	USD 52.9 Billion
Compound Annual Growth Rate (CAGR)	10.1% (2022-2030)
Base Year	2021
Market Forecast Period	2022-2030
Historical Data	2020
Market Forecast Units	Value (USD Billion)
Report Coverage	Market Competitive Landscape, Revenue Forecast, Growth Factors, and Trends
Segments Covered	Type, Application Arê
Geographies Covered	Europe, Asia Pacific, North America, and Rest of the World
Countries Covered	Canada, U.S, Germany, France, UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil
Key Companies Profiled	Nitto Denko Corporation, Zhen Ding Tech, bhflex Co. Ltd., Interflex Co. Ltd., Career Technologies, MFS Technology, Flexible Circuit, Daeduck GDS Co. Ltd., Sumitomo Electric Industries Ltd. and Fujikura Ltd
Key Market Opportunities	Integration of flexible-circuit laminates and thermal performance in electronic devices.
Key Market Dynamics	Increasing Demand for Compact and Flexible Electronic Products. Increased System Reliability.