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    Interconnects and Passive Components Market

    ID: MRFR/SEM/1781-CR
    236 Pages
    Aarti Dhapte
    July 2025

    Interconnects and Passive Components Market By Product Type (Interconnects, Passive Components, Electromechanical Components, Relays, Switches), By Technology (Optical Interconnects, Wireless Interconnects, 5G & Telecom Infrastructure, Surface Mount Technology Components, MEMS-based Components, Others), By End User (Automotive, Consumer Electronics, Telecommunications, Industrial Equipment & Manufacturing, Aerospace & Defense, IT & Data Centers, Power Generation & Distribution, Robotics, Energy & Utilities, Others) &a...

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    Interconnects and Passive Components Market Summary

    The Global Interconnects and Passive Components Market is projected to grow from 157.3 USD Billion in 2024 to 267.7 USD Billion by 2035.

    Key Market Trends & Highlights

    Interconnects and Passive Components Key Trends and Highlights

    • The market is expected to witness a compound annual growth rate (CAGR) of 4.95 percent from 2025 to 2035.
    • By 2035, the market valuation is anticipated to reach 267.7 USD Billion, indicating robust growth potential.
    • In 2024, the market is valued at 157.3 USD Billion, reflecting a strong foundation for future expansion.
    • Growing adoption of advanced technologies due to increasing demand for connectivity is a major market driver.

    Market Size & Forecast

    2024 Market Size 157.3 (USD Billion)
    2035 Market Size 267.7 (USD Billion)
    CAGR (2025-2035) 4.95%

    Major Players

    Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co

    Interconnects and Passive Components Market Drivers

    Market Growth Projections

    The Global Interconnects and Passive Components Market Industry is projected to experience substantial growth in the coming years. With a market value of 157.3 USD Billion in 2024, it is anticipated to reach 267.7 USD Billion by 2035, reflecting a robust CAGR of 4.95% from 2025 to 2035. This growth trajectory is indicative of the increasing reliance on interconnects and passive components across various sectors, including consumer electronics, telecommunications, and automotive industries. The market's expansion is likely to be fueled by ongoing technological advancements and the rising demand for high-performance electronic devices.

    Growth in Automotive Electronics

    The Global Interconnects and Passive Components Market Industry is witnessing a transformative shift due to the increasing complexity of automotive electronics. Modern vehicles are equipped with numerous electronic systems, including advanced driver-assistance systems (ADAS) and infotainment systems, which rely heavily on interconnects and passive components. This trend is expected to drive market growth as automotive manufacturers seek to enhance vehicle performance and safety. The integration of these components is crucial for ensuring reliable communication between various systems. As the automotive sector continues to evolve, the demand for high-quality interconnects and passive components is likely to rise, further propelling market expansion.

    Rising Demand for Consumer Electronics

    The Global Interconnects and Passive Components Market Industry experiences a robust demand surge driven by the proliferation of consumer electronics. As of 2024, the market is valued at 157.3 USD Billion, reflecting a growing reliance on interconnected devices such as smartphones, tablets, and wearables. This trend is likely to continue as technological advancements lead to the development of more sophisticated electronic products. The increasing integration of passive components, such as capacitors and resistors, in these devices is pivotal for enhancing performance and efficiency. Consequently, the industry is poised for growth as consumer preferences shift towards high-performance electronics.

    Technological Advancements in Electronics

    Technological advancements play a critical role in shaping the Global Interconnects and Passive Components Market Industry. Innovations in materials and manufacturing processes are leading to the development of more efficient and compact components. For instance, advancements in printed circuit board technology enable the integration of more passive components in smaller spaces, enhancing overall device performance. This trend is likely to attract investments and foster competition among manufacturers, driving market growth. As the industry adapts to these changes, the demand for cutting-edge interconnects and passive components is expected to increase, supporting the projected CAGR of 4.95% from 2025 to 2035.

    Expansion of Telecommunications Infrastructure

    The Global Interconnects and Passive Components Market Industry is significantly influenced by the expansion of telecommunications infrastructure. With the ongoing rollout of 5G networks, there is a heightened need for reliable interconnects and passive components to support high-speed data transmission. This infrastructure upgrade is expected to drive market growth, as telecommunications companies invest heavily in new technologies. The demand for components that ensure signal integrity and minimize losses is paramount. As a result, the industry is likely to see a substantial increase in revenue, contributing to the projected market value of 267.7 USD Billion by 2035.

    Increasing Focus on Renewable Energy Solutions

    The Global Interconnects and Passive Components Market Industry is also influenced by the increasing focus on renewable energy solutions. As countries worldwide strive to transition to sustainable energy sources, the demand for efficient interconnects and passive components in solar panels and wind turbines is on the rise. These components are essential for optimizing energy conversion and ensuring system reliability. The growth of the renewable energy sector is likely to create new opportunities for manufacturers, as they develop specialized components tailored for these applications. This shift towards sustainability is expected to contribute positively to the overall market dynamics.

    Market Segment Insights

    Interconnects and Passive Components

    Based on Product Type, the Interconnects and Passive Components Market has been segmented into Interconnects, Passive Components, and Electromechanical Components (Emech). The Interconnects segment is further bifurcated into Connectors (Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, Backplane), Cables & Wires, PCB Connectors, Terminals & Interconnection Systems, Others. The Passive Components segment is further bifurcated into Resistors, Capacitors, Inductors, Transformers, Magnetic Components, Sensors, Piezoelectric Components, Others. The Electromechanical Components (Emech) segment is further bifurcated into Relays, Switches (Pushbutton, Toggle, Rotary), Motors & Actuators, Circuit Breakers & Fuses, Solenoids & Valves, Integrated Mechanical Systems, Others. 

    The Interconnects segment dominated the global market in 2024, while the Interconnects segment is projected to be the fastest–growing segment during the forecast period.Interconnects are essential in facilitating the smooth transmission of power, data, and signals between different electronic systems. In the interconnects and passive components industry, connectors like Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, and Backplane connectors are fundamental components that connect different sections of a device or system. 

    Interconnects and Passive Components System

    Based on technology, the Interconnects and Passive Components Market has been segmented into Optical Interconnects, Wireless Interconnects, High-Speed Connectors (USB, HDMI, etc.), 5G and Telecom Infrastructure, Surface Mount Technology (SMT) Components, MEMS-based Components (Micro Electromechanical Systems), Smart Electromechanical Systems (IoT-enabled), and Microactuators & Robotics Integration & others. The Surface Mount Technology (SMT) Components segment dominated the global market in 2024, while the 5G and Telecom Infrastructure segment is projected to be the fastest–growing segment during the forecast period. 

    Surface Mount Technology (SMT) has become a force driving the interconnects and passive components market; it has changed the way electronic devices are assembled. The through-hole component mounts the component through holes in the PCB, whereas SMT components are mounted directly to the surface of the PCB and allow for smaller, reliable designs that are cost-effective. This technology allows for the manufacturing of electronic devices that are smaller and lighter, making it the backbone of everything from smartphones to wearables and automotive electronics.

    Interconnects and Passive Components

    Based on End User, the Interconnects and Passive Components Market has been segmented into Automotive, Consumer Electronics, Telecommunications, Industrial Equipment & Manufacturing, Medical Devices & Healthcare, Aerospace & Defense, IT & Data Centers, Power Generation & Distribution, Robotics, Energy & Utilities, and Others. The Automotive segment dominated the global market in 2024, while the Robotics segment is projected to be the fastest–growing segment during the forecast period. The automotive industry is one of the key end-users of the interconnects and passive components market, being that contemporary vehicles increasingly rely on sophisticated electronic systems for better performance, safety, and comfort. 

    Putting this into perspective, demand for interconnects and passive components has with incredible vigor surged from ADAS, infotainment, powertrain control, and EV systems, to being used in many aspects of automotive operations. Connectors, sensors, resistors, and capacitors play a key role in the facilitation of interchange within electronic systems in an auto high-speed connectors used for infotainment systems, while safety features depend on sensors, such as airbags and collision avoidance systems.

    Get more detailed insights about Interconnects and Passive Components Market Research Report – Forecast Till 2035

    Regional Insights

    Based on the Region, the global Interconnects and Passive Components is segmented into North America, Europe, Asia-Pacific, South America and Middle East & Africa. The Asia Pacific dominated the global market in 2024, while the Asia Pacific is projected to be the fastest–growing segment during the forecast period. Major demand factors driving the Asia Pacific market are The Asia-Pacific interconnects and passive components market is witnessing rapid growth due to fast-paced technological developments and rising demand across different industries. 

    The key growth driver is the growth of consumer electronics, especially in China, Japan, South Korea, and Taiwan, which together account for close to 45% of the world's market share in immersive media technologies. This expansion is fueled by the presence of giant consumer electronics companies and the expansion of the growing middle class with rising disposable incomes. 

    Contributing to the expansion as well is the expansion of the Internet of Things (IoT), where governments and private players are significantly investing in IoT infrastructure to raise connectivity and automation. For instance, Singapore's Infocomm Media Development Authority (IMDA) established plans to build up IoT strengths, as its potential to grow the economy and improve city life is huge.

    FIGURE 3: INTERCONNECTS AND PASSIVE COMPONENTS MARKET VALUE BY REGION 2024 AND 2035 (USD BILLION)

    INTERCONNECTS AND PASSIVE COMPONENTS MARKET VALUE BY REGION 2024 AND 2035

    Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

    Further, the countries considered in the scope of the Application Tracking System Market are the US, Canada, Mexico, Germany, France, the UK, Russia, Spain, Italy, Rest of Europe, China, India, Japan, South Korea, Malaysia, Thailand, Indonesia, Rest of Asia Pacific, Brazil, Argentina, Rest of South America, GCC Countries, South Africa, Rest of MEA and others.

    Key Players and Competitive Insights

    Many global, regional, and local vendors characterize the Interconnects and Passive Components Market. The market is highly competitive, with all the players competing to gain market share. Intense competition, rapid advances in technology, frequent changes in government policies, and environmental regulations are key factors that confront market growth. The vendors compete based on cost, product quality, reliability, and government regulations. Vendors must provide cost-efficient, high-quality products to survive and succeed in an intensely competitive market.

    The major competitors in the market are Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co, among others. The Interconnects and Passive Components Market is a consolidated market due to increasing competition, acquisitions, mergers and other strategic market developments and decisions to improve operational effectiveness.

    Key Companies in the Interconnects and Passive Components Market market include

    Industry Developments

    February 2025: Amphenol Corporation (NYSE: APH) announced it had completed the acquisition of CommScope’s (NASDAQ: COMM) Outdoor Wireless Networks (OWN) and Distributed Antenna Systems (DAS) businesses.

    March 2023: HIROSE Electric Co., Ltd. (Headquarters: Japan), a manufacturer specializing in connectors, and SnapEDA (Headquarters: San Francisco, USA), the internet's first search engine for electronic design, have partnered to release more than 1,000 ready-to use symbols and footprints for a variety of Hirose’s PCB mountable connectors.

    September 2022: Molex, a global electronics leader and connectivity innovator, today announced it is expanding its existing manufacturing operations in Hanoi to include a new 16,000 square meter facility. The company expects the expansion will support over 200 new jobs in advanced high-tech manufacturing.

    December 2021: Vishay Intertechnology, Inc., (NYSE: VSH), one of the world's largest manufacturers of discrete semiconductors and passive electronic components, announced that it has signed a definitive purchase agreement to acquire substantially all of the assets and certain liabilities of Barry Industries for $21 million, subject to working capital and net cash adjustments at closing.

    Interconnects and Passive Components Market Segmentation

    Interconnects and Passive Components by Product Type Outlook

    • Interconnects
      • Connectors (Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, Backplane)
      • Cables & Wires
      • PCB Connectors
      • Terminals & Interconnection Systems
      • Others
    • Passive Components
      • Resistors
      • Capacitors
      • Inductors
      • Transformers
      • Magnetic Components
      • Sensors
      • Piezoelectric Components
      • Others
    • Electromechanical Components (Emech)
      • Relays
      • Switches (Pushbutton, Toggle, Rotary)
      • Motors & Actuators
      • Circuit Breakers & Fuses
      • Solenoids & Valves
      • Integrated Mechanical Systems
      • Others

    Interconnects and Passive Components by Technology Outlook

    • Optical Interconnects
    • Wireless Interconnects
    • High-Speed Connectors (USB, HDMI, etc.)
    • 5G and Telecom Infrastructure
    • Surface Mount Technology (SMT) Components
    • MEMS-based Components (Micro-Electromechanical Systems)
    • Smart Electromechanical Systems (IoT-enabled)
    • Microactuators & Robotics Integration
    • Others

    Interconnects and Passive Components by End User Outlook

    • Automotive
    • Consumer Electronics
    • Telecommunications
    • Industrial Equipment & Manufacturing
    • Medical Devices & Healthcare
    • Aerospace & Defense
    • IT & Data Centers
    • Power Generation & Distribution
    • Robotics
    • Energy & Utilities
    • Others

    Interconnects and Passive Components Regional Outlook 

    • North America
      • US
      • Canada
      • Mexico
    • Europe
      • Germany
      • UK
      • France
      • Russia
      • Italy
      • Spain
      • Rest of Europe
    • Asia-Pacific
      • China
      • India
      • Japan
      • South Korea
      • Malaysia
      • Thailand
      • Indonesia
      • Rest of Asia Pacific
    • South America
      • Brazil
      • Argentina
      • Rest of South America
    • Middle East & Africa
      • GCC Countries
      • South Africa
      • Rest of MEA

    Future Outlook

    Interconnects and Passive Components Market Future Outlook

    The Interconnects and Passive Components Market is projected to grow at a 4.95% CAGR from 2024 to 2035, driven by technological advancements and increasing demand for connectivity solutions.

    New opportunities lie in:

    • Invest in R&D for advanced materials to enhance performance and reduce costs. Develop integrated solutions combining interconnects and passive components for streamlined manufacturing. Expand into emerging markets with tailored products to meet local industry needs.

    By 2035, the market is expected to achieve robust growth, reflecting evolving technological demands and competitive dynamics.

    Market Segmentation

    Regional Outlook

    • {"North America"=>["US"
    • "Canada"
    • "Mexico"]}
    • {"Europe"=>["Germany"
    • "UK"
    • "France"
    • "Russia"
    • "Italy"
    • "Spain"
    • "Rest of Europe"]}
    • {"Asia-Pacific"=>["China"
    • "India"
    • "Japan"
    • "South Korea"
    • "Malaysia"
    • "Thailand"
    • "Indonesia"
    • "Rest of Asia Pacific"]}
    • {"South America"=>["Brazil"
    • "Argentina"
    • "Rest of South America"]}
    • {"Middle East & Africa"=>["GCC Countries"
    • "South Africa"
    • "Rest of MEA"]}

    Interconnects and Passive Components Regional Outlook

    • {"North America"=>["US"
    • "Canada"
    • "Mexico"]}
    • {"Europe"=>["Germany"
    • "UK"
    • "France"
    • "Russia"
    • "Italy"
    • "Spain"
    • "Rest of Europe"]}
    • {"Asia-Pacific"=>["China"
    • "India"
    • "Japan"
    • "South Korea"
    • "Malaysia"
    • "Thailand"
    • "Indonesia"
    • "Rest of Asia Pacific"]}
    • {"South America"=>["Brazil"
    • "Argentina"
    • "Rest of South America"]}
    • {"Middle East & Africa"=>["GCC Countries"
    • "South Africa"
    • "Rest of MEA"]}

    Interconnects and Passive Components by End User Outlook

    • Automotive
    • Consumer Electronics
    • Telecommunications
    • Industrial Equipment & Manufacturing
    • Medical Devices & Healthcare
    • Aerospace & Defense
    • IT & Data Centers
    • Power Generation & Distribution
    • Robotics
    • Energy & Utilities
    • Others

    Interconnects and Passive Components by Technology Outlook

    • Optical Interconnects
    • Wireless Interconnects
    • High-Speed Connectors (USB
    • HDMI
    • etc.)
    • 5G and Telecom Infrastructure
    • Surface Mount Technology (SMT) Components
    • MEMS-based Components (Micro-Electromechanical Systems)
    • Smart Electromechanical Systems (IoT-enabled)
    • Microactuators & Robotics Integration
    • Others

    Interconnects and Passive Components by Product Type Outlook

    • {"Interconnects"=>["Connectors (Board-to-Board
    •  Wire-to-Board
    •  I/O
    •  Fiber Optic
    •  RF
    •  Backplane)"
    • "Cables & Wires"
    • "PCB Connectors"
    • "Terminals & Interconnection Systems"
    • "Others"]}
    • {"Passive Components"=>["Resistors"
    • "Capacitors"
    • "Inductors"
    • "Transformers"
    • "Magnetic Components"
    • "Sensors"
    • "Piezoelectric Components"
    • "Others"]}
    • {"Electromechanical Components (Emech)"=>["Relays"
    • "Switches (Pushbutton
    • Toggle
    • Rotary)"
    • "Motors & Actuators"
    • "Circuit Breakers & Fuses"
    • "Solenoids & Valves"
    • "Integrated Mechanical Systems"
    • "Others"]}

    Report Scope

    Report Attribute/MetricDetails
    Market Size 2024USD 157.28 Billion
    Market Size 2025USD 164.38 Billion
    Market Size 2035USD 267.67 Billion
    Compound Annual Growth Rate (CAGR)5.0% (2025-2035)
    Base Year2024
    Forecast Period2025-2035
    Historical Data2019-2023
    Forecast UnitsValue (USD Billion)
    Report CoverageRevenue Forecast, Competitive Landscape, Growth Factors, and Trends
    Segments CoveredBy Product Type, By Technology, By End User
    Geographies CoveredNorth America, Europe, Asia Pacific, South America, Middle East & Africa
    Countries CoveredThe US, Canada, Mexico, Germany, France, the UK, Russia, Spain, Italy, Rest of Europe, China, India, Japan, South Korea, Malaysia, Thailand, Indonesia, Rest of Asia Pacific, Brazil, Argentina, Rest of South America, GCC Countries, South Africa, Rest of MEA
    Key Companies ProfiledKyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co
    Key Market Opportunities

    ·         Expansion of 5g infrastructure

    ·         Growth in emerging markets

    Key Market Dynamics

    ·         Growing demand for consumer electronics

    ·         Advancements in 5g and IOT technologies

    Market Highlights

    Author
    Aarti Dhapte
    Team Lead - Research

    She holds an experience of about 6+ years in Market Research and Business Consulting, working under the spectrum of Information Communication Technology, Telecommunications and Semiconductor domains. Aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. Her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

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    FAQs

    How much is the Interconnects and Passive Components Market?

    USD 157.28 Billion is the Interconnects and Passive Components Market in 2024

    Which Technology holds the largest market share?

    The Surface Mount Technology (SMT) Components segment by Technology holds the largest market share and grows at a CAGR of 2.8% during the forecast period.

    Which region holds the largest market share in the Interconnects and Passive Components Market?

    Asia Pacific holds the largest market share in the Interconnects and Passive Components Market.

    Who are the prominent players in the Interconnects and Passive Components Market?

    Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co are prominent players in the Interconnects and Passive Components Market.

    Which End User segment led the Interconnects and Passive Components Market?

    The Automotive segment dominated the market in 2024.

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